U. B. Jayadeep

Employment

• National Institute of Technology Calicut Associate Professor
  2022 - Present
• National Institute of Technology Calicut Assistant Professor
  2005 - 2022
• GE Aircraft Engines Lead Engineer
  2003 - 2005
• Larsen and Toubro Limited Development Engineer
  1998 - 2001

Education

• Indian Institute of Technology Kanpur M.Tech.
  2001 - 2003
• National Institute of Technology Calicut B.Tech.
  1994 - 1998

Projects & Funding

Projects & funding information is unavailable.

Publications (16)

• Multicell mesoscale modeling of concrete: A computationally efficient alternative to random aggregate structures
  Structures 2026 DOI: 10.1016/j.istruc.2026.112823
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• Effect of adhesion on the dynamics of an AFM cantilever
  Industrial Lubrication and Tribology 2026 DOI: 10.1108/ILT-12-2025-0554
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• An efficient computational model for adhesive contact mechanics based on a lumped parameter formulation
  Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 2023 DOI: 10.1177/13506501221144719
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• Comparison of Temperature Profiles Obtained by 3D and 2D Analysis of Welding Process
  2023 DOI: 10.1007/978-981-19-4556-4_13
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• CFD modelling of ultra-high rotational speed micro friction stir welding
  Journal of Manufacturing Processes 2021 DOI: 10.1016/j.jmapro.2021.02.060
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• Lumped parameter models for adhesive contact mechanics
  International Journal of Advances in Engineering Sciences and Applied Mathematics 2020 DOI: 10.1007/s12572-020-00265-7
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• A molecular dynamics study of liquid layering and thermal conductivity enhancement in nanoparticle suspensions
  Heat and Mass Transfer/Waerme- und Stoffuebertragung 2018 DOI: 10.1007/s00231-017-2175-4
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• Energy Loss Due to Adhesion during the Impact of Elastic Spheres
  Procedia Engineering 2017 DOI: 10.1016/j.proeng.2016.12.004
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• A body-force formulation for analyzing adhesive interactions with special considerations for handling symmetry
  Finite Elements in Analysis and Design 2016 DOI: 10.1016/j.finel.2016.04.001
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• Liquid layering and the enhanced thermal conductivity of ar-cu nanofluids: A molecular dynamics study
  ASME 2016 Heat Transfer Summer Conference, HT 2016, collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels 2016 DOI: 10.1115/HT2016-7385
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