Ke Bai

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Publications (4)

• Assembly of complex 3D structures and electronics on curved surfaces
  Science Advances 2022 DOI: 10.1126/sciadv.abm6922
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• Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials
  Science Advances 2022 DOI: 10.1126/sciadv.abm3785
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• Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices
  Proceedings of the National Academy of Sciences 2021 DOI: 10.1073/pnas.2026414118
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• Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy
  Science Advances 2020 DOI: 10.1126/sciadv.abb7417
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