mrunali sona

Employment

• Kumamoto Daigaku Post doctoral researcher
  2017 - Present

Education

Education history is unavailable.

Projects & Funding

Projects & funding information is unavailable.

Publications (12)

• Evaluation of final irrigation regimens with maleic acid for smear layer removal and wettability of root canal sealer
  Acta Odontologica Scandinavica 2018 DOI: 10.1080/00016357.2017.1402208
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• Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
  Materials Performance and Characterization 2017 DOI: 10.1520/MPC20160058
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• Effects of smear layer removal agents on the physical properties and microstructure of mineral trioxide aggregate cement
  Journal of Dentistry 2017 DOI: 10.1016/j.jdent.2017.08.018
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• The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints
  Journal of Materials Engineering and Performance 2017 DOI: 10.1007/s11665-017-2857-6
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• Assessment of Joint Reliability of Sn–2.5Ag–0.5Cu Solder/Cu as a Function of Reflow Time
  Transactions of the Indian Institute of Metals 2016 DOI: 10.1007/s12666-015-0590-0
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• Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
  Journal of Electronic Materials 2016 DOI: 10.1007/s11664-016-4504-7
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• Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time
  Transactions of the Indian Institute of Metals 2015 DOI: 10.1007/s12666-015-0640-7
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• Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
  Materials Science Forum 2015 DOI: 10.4028/www.scientific.net/MSF.830-831.215
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• Wetting kinetics and joint strength of Sn-0.3Ag-0.7Cu lead-free solder alloy on copper substrate as a function of reflow time
  Materials Science Forum 2015 DOI: 10.4028/www.scientific.net/MSF.830-831.286
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• The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy
  Journal of Materials Science: Materials in Electronics 2014 DOI: 10.1007/s10854-014-1749-x
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