0000-0002-0633-797X Employment
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Publications (3)
- A novel method for measuring viscoelastic parameters of epoxy resins under water bath environments using embedded strain gauges Save
- Research on the relationship between time-dependent strains and delamination of plastic packaged devices at polymer/copper interface under thermal-hygro environments Save
- A simulating method of moisture continuous diffusion under changing temperatures and analysis of moisture-induced stresses covering moisture desorption and reflow processes for the QFN Save