Dr. Basanta Kumar Parida
Also known as: Basanta
ST XAVIER GROUP OF INSTITUTES, Institute for Plasma Research, Indian Institute of Technology Ropar
About
My research interests include the following
--ion induced nanopatterning and applications,
--plasma fire ball mediated wettability gradient surface for better water condensation
--plasma processing for diverse applications
--thin film deposition (PVD-Magnetron sputtering, spin and dip coating)
--plasma etching of surfaces and wettability study of plasma treated of polymers
--sputter yield measurement of plasma thruster-wall materials
--Plasma fireball mediated nonvolatile memory device preparation
Employment
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ST XAVIER GROUP OF INSTITUTES JEE FACULTY2023 - 2026
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Institute for Plasma Research Postdoctoral Fellow2020 - 2023
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Indian Institute of Technology Ropar Director's fellowship2019 - 2020
Education
Education history is unavailable.
Projects & Funding
Projects & funding information is unavailable.
Publications (19)
- Scalable fabrication of superhydrophobic copper surfaces via plasma processing for atmospheric water harvesting Save
- The Macromolecular Transition of Kapok Fiber by RF Plasma Treatment Investigated by SAXS/WAXD Studies and Their Correlation With Electrical Properties of the Fiber‐Reinforced Composites Save
- The Macromolecular Transition of Kapok Fiber by RF Plasma Treatment Investigated by SAXS/WAXD Studies and Their Correlation With Electrical Properties of the Fiber-Reinforced Composites Save
- Processing and plasma erosion characterization of isotropic hexagonal BN/amorphous silica composite Save
- Anisotropic wettability transition on nanoterraced glass surface by Ar ions Save
- Investigation of facet evolution on Si surfaces bombarded with Xe ions Save
- Au/Ag SERS active substrate for broader wavelength excitation Save
- Development of Superhydrophobic PTFE Surface Using Oxygen Plasma Processing Save
- Comparative wettability study of bulk and thin film of polytetrafluoroethylene after low energy ion irradiation Save
- Pinning of graphene for conformal wrinkling over a soft corrugated substrate through prestretch-release process Save