Vikas Dubey

Employment

Employment history is unavailable.

Education

• Katholieke Universiteit Leuven Doctorate
  2012 - 2017
• Amity University M.Tech
  2006 - 2012

Projects & Funding

Projects & funding information is unavailable.

Publications (16)

• Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis
  ECS Journal of Solid State Science and Technology 2024 DOI: 10.1149/2162-8777/ad7d3b
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• Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
  ECS Journal of Solid State Science and Technology 2024 DOI: 10.1149/2162-8777/ad8519
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• Process and Design Challenges for Hybrid Bonding
  ECS Meeting Abstracts 2023 DOI: 10.1149/MA2023-02331593mtgabs
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• Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
  ECS Meeting Abstracts 2023 DOI: 10.1149/MA2023-02331619mtgabs
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• Process and Design Challenges for Hybrid Bonding
  ECS Transactions 2023 DOI: 10.1149/11203.0073ecst
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• Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
  ECS Transactions 2023 DOI: 10.1149/11203.0247ecst
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• Evaporation of confined droplet between parallel chips with varying gap at room temperature
  Journal of Micromechanics and Microengineering 2022 DOI: 10.1088/1361-6439/ac6ebe
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• Physics of self-aligned assembly at room temperature
  Physics of Fluids 2018 DOI: 10.1063/1.5004797
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• Die to wafer 3D stacking for below 10um pitch microbumps
  2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 2017 DOI: 10.1109/3DIC.2016.7969993
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• 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects
  Proceedings - Electronic Components and Technology Conference 2016 DOI: 10.1109/ECTC.2016.377
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