Vishnu Busi Reddy

Employment

Employment history is unavailable.

Education

• Georgia Institute of Technology PhD
  2016 - 2020

Projects & Funding

Projects & funding information is unavailable.

Publications (4)

• Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2021 DOI: 10.1109/TCPMT.2021.3065958
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• Evaluation of FCBGA Package Subjected to Four-Point Bend Reliability Test Using Fiber Array Laser Ultrasonic Inspection System
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2019 DOI: 10.1109/TCPMT.2019.2911073
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• Feasibility Studies and Advantages of Using Dual Fiber Array in Laser Ultrasonic Inspection of Electronic Chip Packages
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2019 DOI: 10.1109/TCPMT.2019.2896603
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• Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique
  2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018 DOI: 10.1109/ectc.2018.00118
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