saif wakeel

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Publications (18)

• Etching-Free Fabrication and Integration of 45° Micro-Mirror for Surface-Compatible Photonic Packaging
  Journal of Lightwave Technology 2024 DOI: 10.1109/JLT.2024.3439134
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• Demonstration of Micro-transfer Printing Thick Optical Components on Glass and Silicon Wafers
  2024 DOI: 10.1007/978-3-031-63378-2_14
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• Micro-transfer printing of thick optical components using a tether-free UV-curable approach
  Journal of Optical Microsystems 2023 DOI: 10.1117/1.JOM.4.1.011003
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• A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries
  Soft Computing 2023 DOI: 10.1007/s00500-023-08668-x
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• Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
  Journal of Materials Science: Materials in Electronics 2023 DOI: 10.1007/s10854-022-09722-4
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• Effects of Commercial No-Clean Flux on Reliability of Fine Pitch Flip-Chip Package With Solder Bumps and Copper Pillars
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2022 DOI: 10.1109/TCPMT.2022.3191604
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• Investigation Into Chemistry and Performance of No-Clean Flux in Fine Pitch Flip-Chip Package
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2022 DOI: 10.1109/TCPMT.2021.3109885
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• Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix
  Muhammad Nasir Bashir, A.S.M.A. Haseeb, Saif Wakeel +5 more
  Journal of Materials Science: Materials in Electronics 2022 DOI: 10.1007/s10854-022-08827-0
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• Selection of Automotive Brake Material Using Different MCDM Techniques and Their Comparisons
  Farheen Jahan, Manoj Soni, Saif Wakeel

  +2 more

  • Shafi Ahmad
  • Sedat Bingöl
  Journal of Engineering Science and Technology Review 2022 DOI: 10.25103/jestr.151.04
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• Selection of sustainable material for the manufacturing of complex automotive products using a new hybrid Goal Programming Model for Best Worst Method–Proximity Indexed Value method
  Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 2021 DOI: 10.1177/1464420720966347
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• A new hybrid LGPMBWM-PIV method for automotive material selection
  Informatica (Slovenia) 2021 DOI: 10.31449/inf.v45i1.3246
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• Constituents and performance of no-clean flux for electronic solder
  Microelectronics Reliability 2021 DOI: 10.1016/j.microrel.2021.114177
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• Effect of plasma and staging time on the underfill voids in fine pitch flip-chip package
  2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021 2021 DOI: 10.1109/ICEPT52650.2021.9567952
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• Supplier Selection for High Temperature Die Attach by hybrid Entropy-Range of Value MCDM Technique: A Semiconductor Industry
  Saif Wakeel, Shafi Ahmad, Sedat Bingöl +3 more
  2020 21st International Conference on Electronic Packaging Technology (ICEPT) 2020 DOI: 10.1109/icept50128.2020.9202994
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• Surface treatments of plant fibers and their effects on mechanical properties of fiber-reinforced composites: A review
  Rashid Latif, Saif Wakeel, Noor Zaman Khan +3 more
  Journal of Reinforced Plastics and Composites 2019 DOI: 10.1177/0731684418802022
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• Microcontroller-Based Control of Ceiling Fans for Household Power Reduction and Human Comfort
  Lecture Notes in Electrical Engineering 2019 DOI: 10.1007/978-981-13-6772-4_112
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• Enhancing Mechanical Response of Monolithic Magnesium Using Nano-NiTi (Nitinol) Particles
  Gururaj Parande, Vyasaraj Manakari, Saif Wakeel +2 more
  Metals 2018 DOI: 10.3390/met8121014
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• Synthesis and Mechanical Response of NiTi SMA Nanoparticle Reinforced Mg Composites Synthesized through Microwave Sintering Process
  Saif Wakeel, Vyasaraj Manakari, Gururaj Parande +3 more
  Materials Today: Proceedings 2018 DOI: 10.1016/j.matpr.2018.10.064
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