Vishal Mehta

Employment

• EVgo Services LLC Sr Reliability Engineer
  2025 - Present
• Auburn University GRA & Ph.D. Candidate
  2018 - 2025
• Uka Tarsadia University Assistant Professor
  2013 - 2018
• Gujarat State Petronet Limited Engineer/Officer
  2008 - 2011

Education

• Auburn University Ph.D.
  2018 - 2025
• Sardar Vallabhbhai National Institute of Technology Surat Masters of technology
  2011 - 2013
• Veer Narmad South Gujarat University Bachelor of Engineering
  2005 - 2008
• Technical Examination Board, Gujarat, India Diploma in Engineering
  2002 - 2004

Projects & Funding

Projects & funding information is unavailable.

Publications (39)

• Study On the Reliability of Lead-Free Solder Joint Assemblies Under Combined Effects of Vibrations and Extended High-Temperature Exposure
  Journal of Electronic Packaging 2026 DOI: 10.1115/1.4071140
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• Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration
  Proceedings 2026 27th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems Eurosime 2026 2026 DOI: 10.1109/EuroSimE69483.2026.11511964
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• Damage Model for Assessment of the Combined Effects of High-Temperature Storage and Harmonic Vibration on Reliability of Lead-Free Doped Solder Joint Assemblies
  Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Itherm 2025 DOI: 10.1109/ITherm55376.2025.11235685
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• High Strain Rate Property Prediction and the Effect of Bismuth Concentration on the High-G Level Shock Damage with Sustained High-Temperature Operation
  Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Itherm 2025 DOI: 10.1109/ITherm55376.2025.11235698
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• Prediction of Effects of Bi-Addition in SnAgCu Solders on High Strain Rate Properties
  Proceedings Electronic Components and Technology Conference 2025 DOI: 10.1109/ECTC51687.2025.00238
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• Prediction of High Strain Rate Properties of SAC-Bi Solders under Sustained High-Temperature Operation
  2025 Pan Pacific Strategic Electronics Symposium Pan Pacific 2025 2025 DOI: 10.23919/PanPacific65826.2025.10908931
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• Prediction of High Strain Rate Properties of Bi-Doped SnAgCu Solders after Sustained High-Temperature Operation
  2024 IEEE 10th Electronics System Integration Technology Conference Estc 2024 Proceedings 2024 DOI: 10.1109/ESTC60143.2024.10712081
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• Study of High-G Level Shock Damage-Accrual in Doped/Undoped SAC Solders during Prolonged Sustained Operation at 100°C
  Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Itherm 2024 DOI: 10.1109/ITherm55375.2024.10709429
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• STUDY ON THE IMPACT OF PROLONGED HIGH-TEMPERATURE EXPOSURE ON THE RELIABILITY OF LEAD-FREE SOLDER JOINT ASSEMBLIES UNDER VIBRATION
  Proceedings of ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Interpack 2024 2024 DOI: 10.1115/IPACK2024-141845
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• Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
  Journal of Electronic Packaging, Transactions of the ASME 2024 DOI: 10.1115/1.4064521
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