Yuvaraj R

Employment

• Sona College of Technology Associate Professor
  2012 - Present

Education

• Government College of Engineering Salem M.E. Thermal
  2010 - 2012

Projects & Funding

Projects & funding information is unavailable.

Publications (12)

• Geometric effects on transient and steady-state heat transfer in micro pin fins: a finite element study
  Applied Thermal Engineering 2026 DOI: 10.1016/j.applthermaleng.2026.131468
  +Save
• Shape optimization of keel in ship hydrodynamics using computational fluid dynamics
  Aip Conference Proceedings 2026 DOI: 10.1063/5.0334371
  +Save
• Real-time fire detection and suppression system using YOLO11n and Raspberry Pi for thermal safety applications
  Case Studies in Thermal Engineering 2025 DOI: 10.1016/j.csite.2025.107159
  +Save
• Mathematical modelling of evaporation rate and heating of biodiesel blends of a single-component droplets
  Journal of Thermal Engineering 2023 DOI: 10.18186/thermal.1401508
  +Save
• Numerical analysis of non-Fourier heat conduction dynamics in the composite layer
  Journal of Mechanical Engineering and Sciences 2023 DOI: 10.15282/jmes.17.3.2023.6.0760
  +Save
• Heat transfer model for dropwise condensation on hydrophobic and superhydrophobic interfaces
  Journal of Thermal Engineering 2023 DOI: 10.18186/thermal.1374673
  +Save
• Experimental investigation of frosting behavior on superhydrophobic copper surface prepared by thermal evaporation Method
  Proceedings of the Institution of Mechanical Engineers Part A Journal of Power and Energy 2022 DOI: 10.1177/09576509211070428
  +Save
• A COMPARATIVE STUDY OF DIFFUSION, THERMAL WAVE AND DUAL-PHASE-LAG HEAT CONDUCTION IN THIN LAYER
  Journal of Thermal Science and Technology 2021 DOI: 10.47480/isibted.979363
  +Save
• Study of droplet dynamics and condensation heat transfer on superhydrophobic copper surface
  Thermal Science 2020 DOI: 10.2298/tsci190126089y
  +Save
• Numerical simulation of thermal wave propagation and collision in thin film using finite element solution
  Journal of Thermal Analysis and Calorimetry 2020 DOI: 10.1007/s10973-020-09346-y
  +Save