SURILA GUGLANI

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Publications (9)

• A Multi-Fidelity Polynomial Chaos Approach for Uncertainty Quantification of MWCNT Interconnect Networks in the Presence of Imperfect Contacts
  2021 IEEE 25th Workshop on Signal and Power Integrity (SPI) 2021 DOI: 10.1109/spi52361.2021.9505239
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• Two-Level Multifidelity Algorithm With Dimension Reduction for Efficient Uncertainty Quantification of MWCNT Interconnects
  IEEE Transactions on Electromagnetic Compatibility 2021 DOI: 10.1109/temc.2021.3067358
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• Predictor-Corrector Algorithm with Embedded Dimension Reduction for Uncertainty Quantification of MWCNT On-Chip Interconnect Networks
  2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2020 DOI: 10.1109/epeps48591.2020.9231497
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• A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2020 DOI: 10.1109/TCPMT.2020.3004414
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• Role of Grain Size on the Effective Resistivity of Cu-Graphene Hybrid Interconnects
  2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020 DOI: 10.1109/ectc32862.2020.00254
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• Development of Improved Predictor for Expedited Training of Polynomial Chaos Metamodels of Multi-Walled Carbon Nanotube Interconnects
  2020 IEEE 24th Workshop on Signal and Power Integrity (SPI) 2020 DOI: 10.1109/spi48784.2020.9218151
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• Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects
  2020 IEEE 24th Workshop on Signal and Power Integrity (SPI) 2020 DOI: 10.1109/spi48784.2020.9218199
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• Statistical Analysis of Temperature Variability on the Write Efficiency of Spin-Orbit Torque MRAM using Polynomial Chaos Metamodels
  2020 21st International Symposium on Quality Electronic Design (ISQED) 2020 DOI: 10.1109/isqed48828.2020.9137004
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• Temperature-Aware Closed-Form Matrix Rational Approximation Model for Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects
  2019 Electrical Design of Advanced Packaging and Systems (EDAPS) 2019 DOI: 10.1109/edaps47854.2019.9011623
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