Dr Ashutosh Rajput

Employment

• Indian Institute of Technology Ropar Research Associate-III
  2023 - Present
• Indian Institute of Technology Roorkee Research Associate
  2022 - 2023

Education

Education history is unavailable.

Projects & Funding

Projects & funding information is unavailable.

Publications (12)

• Molecular dynamics simulation of dry sliding between non-Gaussian copper rough surfaces
  Applied Surface Science 2024 DOI: 10.1016/j.apsusc.2024.160220
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• Friction and wear study of metallic contacts under dry sliding conditions: A molecular dynamics simulation-based approach
  Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 2024 DOI: 10.1177/13506501231220076
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• A review on computational modeling of instability and degradation issues of halide perovskite photovoltaic materials
  WIREs Computational Molecular Science 2023 DOI: 10.1002/wcms.1677
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• Influence of hard inclusion on Bauschinger effect and cyclic deformation behavior: an atomistic simulation on single-crystal and polycrystal aluminum
  Materials Today Communications 2023 DOI: 10.1016/j.mtcomm.2022.105126
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• Bauschinger Effect Analysis in Polycrystalline Copper: an Atomistic Simulation
  Transactions of the Indian National Academy of Engineering 2022 DOI: 10.1007/s41403-021-00266-3
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• Effect of void in deformation and damage mechanism of single crystal copper: a molecular dynamics study
  Modelling and Simulation in Materials Science and Engineering 2021 DOI: 10.1088/1361-651X/ac3051
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• Effect of soft and hard inclusions in tensile deformation and damage mechanism of Aluminum: A molecular dynamics study
  Journal of Alloys and Compounds 2021 DOI: 10.1016/j.jallcom.2021.159213
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• Deformation inhomogeneity at the crack tip of polycrystalline copper
  Materials Today Communications 2021 DOI: 10.1016/j.mtcomm.2020.101781
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• Cyclic Plastic Deformation Response of Nanocrystalline BCC Iron
  Metals and Materials International 2021 DOI: 10.1007/S12540-019-00475-0
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• Effect of different tensile loading modes on deformation behavior of nanocrystalline copper: Atomistic simulations
  Results in Materials 2019 DOI: 10.1016/j.rinma.2019.100042
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