Pushparajah Rajaguru

Employment

Employment history is unavailable.

Education

• University of Greenwich PhD
  2008 - 2011
• University of Salford M.Phil
  2003 - 2006
• Kingston University B.Sc (Joint honours in mathematics and computer sciences)

Projects & Funding

Projects & funding information is unavailable.

Publications (32)

• Anand model parameter estimation for the aluminium wirebond in power electronic module and lifetime prediction by combining the finite element analysis and machine learning
  Microelectronics Reliability 2025 DOI: 10.1016/j.microrel.2025.115954
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• Damage mechanics-based Failure Prediction of Wirebond in Power Electronic Module
  IEEE Access 2023 DOI: 10.1109/access.2023.3342689
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• Parametrising Temperature Dependent Properties in Thermal-Mechanical Analysis of Power Electronics Modules using Parametric Model Order Reduction
  Proceedings of the International Spring Seminar on Electronics Technology 2023 DOI: 10.1109/ISSE57496.2023.10168468
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• Smart Manufacturing with Artificial Intelligence and Digital Twin: A Brief Review
  8th International Conference on Information Technology Trends: Industry 4.0: Technology Trends and Solutions, ITT 2022 2022 DOI: 10.1109/ITT56123.2022.9863938
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• Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure
  2021 27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021 2021 DOI: 10.1109/THERMINIC52472.2021.9626396
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• Modelling and analysis of vibration on power electronic module structure and application of model order reduction
  Microelectronics Reliability 2020 DOI: 10.1016/j.microrel.2020.113697
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• Design of Additively Manufactured Heatsinks for Power Electronics Thermal Management using Adjoint Level-set Topology Optimization
  THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems 2019 DOI: 10.1109/THERMINIC.2019.8923530
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• Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications
  IEEE Access 2019 DOI: 10.1109/ACCESS.2019.2911260
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• Time integration damage model for Sn3.5Ag solder interconnect in power electronic module
  IEEE Transactions on Device and Materials Reliability 2019 DOI: 10.1109/TDMR.2019.2891949
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• A Numerical Procedure for the Optimization of IGBT Module Packaging
  Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 2018 DOI: 10.1109/ICEPT.2018.8480746
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