Feng Li

Employment

• China National Electric Apparatus Research Institute (China) Senior R&D specialist
  2025 - Present
• Technical University of Denmark Postdoc Fellow
  2021 - 2025
• Technical University of Denmark Research Assistant
  2017 - 2017
• Technical University of Denmark
  ? - 2025

Education

• Technical University of Denmark Ph. D.
  2018 - 2021
• Danmarks Tekniske Universitet Msc
  2015 - 2017

Projects & Funding

Projects & funding information is unavailable.

Publications (19)

• Investigation of kinetics of ECM dendrite growth during corrosion in electronics
  Corrosion Science 2026 DOI: 10.1016/j.corsci.2025.113575
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• Investigation on the effect of different components of no-clean flux chemistry on coating performance for printed circuit boards
  Corrosion Science 2025 DOI: 10.1016/j.corsci.2025.113104
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• Performance degradation and failure characterization of Li-ion batteries in hearing aids: Insights from field data
  Journal of Power Sources 2025 DOI: 10.1016/j.jpowsour.2025.236764
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• Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method
  Microelectronics Reliability 2024 DOI: 10.1016/j.microrel.2024.115452
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• Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices
  npj Materials Degradation 2024 DOI: 10.1038/s41529-024-00440-2
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• Effect of flux activator in reflow process related flux residue on the climatic reliability of surface-mount electronic devices
  Journal of Materials Science: Materials in Electronics 2023 DOI: 10.1007/s10854-023-10708-z
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• Amino Acids as Activators for Wave Solder Flux Systems: Investigation of Solderability and Humidity Effects
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2022 DOI: 10.1109/TCPMT.2022.3167389
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• Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effects
  Journal of Materials Science: Materials in Electronics 2022 DOI: 10.1007/s10854-022-08012-3
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• Effect of intrinsic PCB parameters on the performance of fluoropolymer coating under condensing humidity conditions
  Microelectronics Reliability 2021 DOI: 10.1016/j.microrel.2021.114158
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• Transformation of reflow solder flux residue under humid conditions
  Microelectronics Reliability 2021 DOI: 10.1016/j.microrel.2021.114195
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