Amit Kumar

Employment

• National Institute of Technology Kurukshetra Assistant Professor
  2025 - Present
• Pandit Deendayal Energy University School of Technology Assistant Professor
  2022 - 2025

Education

• Indian Institute of Technology Roorkee Ph.D.
  2015 - 2021
• National Institute of Technology Kurukshetra M.Tech.
  2010 - 2012
• Maharshi Dayanand University B.E.
  2006 - 2010

Projects & Funding

Projects & funding information is unavailable.

Publications (17)

• Signal Integrity Analysis of Cu-CNT Based Shield DM-TGV Using Temperature and Roughness-Aware EM-RA Technique for 3D Integration
  IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2026 0 citations DOI: 10.1109/TCAD.2025.3648614
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• Accurate Resistance Modeling of Cu-CNT ULSI Interconnects
  International Conference for Advancement in Technology (ICONAT) 2023 0 citations DOI: 10.1109/ICONAT57137.2023.10080728
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• Design and Development of Time and Memory-Efficient Video Translation Tool
  International Conference for Emerging Technology (INCET) 2023 1 citation DOI: 10.1109/INCET57972.2023.10170354
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• Efficient High-Gain Operational Amplifier Design for Sigma-Delta ADCs in VLSI
  International Conference on Futuristic Technologies (INCOFT) 2023 1 citation DOI: 10.1109/INCOFT60753.2023.10425580
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• Transient Analysis of Hybrid Cu-CNT On-Chip Interconnects Using MRA Technique
  IEEE Open Journal of Nanotechnology 2022 20 citations DOI: 10.1109/ojnano.2021.3138344
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• Edge and Dielectric Surface Roughness-Aware EM-RA Model for MLGNR Interconnects
  IEEE Transactions on Nanotechnology 2021 4 citations DOI: 10.1109/tnano.2021.3093174
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• Edge-Roughness Aware EM-RA Model for Signal Integrity Analysis in MLGNR Interconnects
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2021 9 citations DOI: 10.1109/tcpmt.2020.3043198
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• Transient analysis of graphene-based on-chip interconnects using closed-form MRA model
  Semiconductor Science and Technology 2021 2 citations DOI: 10.1088/1361-6641/abf905
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• Exponential Matrix–Rational Approximation (EM-RA) Model for SWCNT Bundle and Hybrid Cu-CNT Interconnects
  IEEE Transactions on Electromagnetic Compatibility 2021 5 citations DOI: 10.1109/temc.2020.3037204
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• A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2020 14 citations DOI: 10.1109/tcpmt.2020.3004414
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