KP
0000-0002-8030-085X About
I am pursuing a Ph.D. in Mechanical Engineering at the Indian Institute of Technology Bombay. I have received the prestigious Prime Minister's Research Fellowship for my Ph.D. program. I am working on Electroless Deposition as my Ph.D. dissertation. I am developing 3D microstructures, i.e., through vias, embedded 3D passive devices on fused silica and silicon materials, and use Electroless Plating to deposit a thin seed layer for succeeding electroplating of the microfeatures for MEMS industrial applications.
Employment
Employment history is unavailable.
Education
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Indian Institute of Technology Bombay Ph.D.2021 - Present
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Indian Institute of Technology Bombay M.Tech.2018 - 2020
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University of Mumbai B.E.2014 - 2017
Projects & Funding
Projects & funding information is unavailable.
Publications (14)
- Investigations into electroless copper seed layer deposition in through-glass vias based 3D packaging Save
- Adhesion-promoting surface modification with zinc-oxide and graphene-oxide for direct electroless metallization in through-glass vias (TGVs) Save
- Synergistic enhancement of electroless film adhesion on glass via graphene-oxide functionalization and surface roughening Save
- Fabrication of Through Alumina Vias: An Alternative Approach Using Ultrasonic Machining and Electroless Deposition Save
- Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias Save
- Facilitating electroless metalization of blind holes in glass substrates by electrochemical discharge-assisted surface roughening Save
- Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation Save
- Through Glass Vias Fabrication using Ultrasonic Micromachining and Electroless Deposition Save
- Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging Save
- A critical review of copper electroless deposition on glass substrates for microsystems packaging applications Save