About
Liming Si (Senior Member, IEEE) received the Ph.D. degree in electromagnetic field and microwave technology from the Beijing Institute of Technology (BIT), Beijing, China, in 2012.
He is currently a Full Professor in the Department of Electronic Engineering at the BIT, where he serves as the Vice Dean of the School of Integrated Circuits and Electronics. His research interests include electromagnetics, metamaterials, antennas, and terahertz technologies. He has published over 160 peer-reviewed papers and holds more than 20 patents. Prof. Si serves as Vice Chair of the Technical Committee on Intelligent Metasurfaces, China Institute of Communications; Vice Chair of the Electronic Metrology Professional Committee, China Society for Measurement and Testing; Council Member of the Chinese Metamaterials Society; Board Member of the National Artificial Intelligence Metrology Collaborative Innovation Alliance; and Council Member of the Intelligent Metasurface Technology Alliance. He is an Editorial Board Member of Electronics, Chips, International Journal of Optics, Journal of Antennas, Journal of Harbin Institute of Technology, and Science & Technology Review. He has also served as a Guest Editor for Nanomaterials and IET Microwaves, Antennas & Propagation.
He has actively contributed to the academic community as a technical committee member, program committee member, or session chair for numerous international and national conferences, including the IEEE MTT-S International Microwave Symposium (IMS) series, Progress in Electromagnetics Research Symposium (PIERS), International Conference on Microwave and Millimeter Wave Technology (ICMMT), Conference on Radio Frequency and Microwave Measurements (CRFM), China Microwave Week, the National Antenna Conference, the National Metamaterials Conference, and the World Photonics Congress – Terahertz Technology and Applications Symposium. He is a Senior Member of the IEEE, Chinese Institute of Electronics (CIE), and China Institute of Communications (CIC).
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Publications (319)
- Ultra-thin double-layer plasmonic metalens with ultra-broadband bandwidth and high numerical aperture Save
- Hybrid Equivalent Circuit-Deep Neural Network Design of Optically Transparent Metasurface with Microwave RCS Reduction Save
- Terahertz dual-polarization 3-bit coding metasurface based on two pairs of C-shaped split-ring resonators for holographic imaging Save
- A 48 ps Resolution, Timing Chip Constructed from Two Expandable 32-Channel Register-only TDCs Save
- Complex-Amplitude Janus Metasurface for Asymmetric 3-D Holography Save
- Highly Sensitive Sensor With Low‐Profile Based on TGV Save
- Hybrid Neural Network-Driven Inverse Design of Metasurface for Ultrabroadband RCS Reduction Save
- Frequency Selective Rasorber With Low Insertion Loss and Ultra‐Broadband Scattering Reduction Save
- Transmission–eflection-integrated metasurface for full-space, six-channel, and polarization-multiplexed holography Save
- Dynamic manipulation of high-order Poincaré sphere polarization states via a transmissive space-time-coding metasurface Save