GIRISH KUMAR

Employment

• VIT-AP University Associate Professor
  2024 - Present
• Teegala Krishna Reddy College of Engineering and Technology Associate Professor
  2020 - Present
• Vidya Jyothi Institute of Technology Associate Professor
  2017 - 2020

Education

• National Institute of Technology Hamirpur Ph.D.
  2013 - 2017

Projects & Funding

Projects & funding information is unavailable.

Publications (29)

• Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs
  IEEE Access 2025 DOI: 10.1109/ACCESS.2025.3547963
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• Reliability Assessment Using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2025 DOI: 10.1109/TCPMT.2025.3587385
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• Design of Efficient RAM Cell using Quantum-Dot Cellular Automata
  2024 International Conference on Computer, Electronics, Electrical Engineering and their Applications, IC2E3 2024 2024 DOI: 10.1109/IC2E362166.2024.10827736
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• Signal Integrity Assessment of GNRFET-Based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion
  ECS Journal of Solid State Science and Technology 2023 DOI: 10.1149/2162-8777/acc68b
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• Effective Low Power ALU Design with Incorporation of MWCNTB On-chip Interconnects
  Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022 DOI: 10.1109/EPTC56328.2022.10013187
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• Process variations in dielectric inserted side contact multilayer graphene nanoribbon interconnects using montecarlo simulations
  Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022 DOI: 10.1109/EPTC56328.2022.10013293
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• A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects
  Microelectronics Journal 2021 DOI: 10.1016/j.mejo.2021.105294
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• CNTFET Based Low Power Repeaters for On-Chip Interconnect System
  2021 25th International Symposium on VLSI Design and Test, VDAT 2021 2021 DOI: 10.1109/VDAT53777.2021.9600928
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• Impact of temperature on structure deformation for monolithic inter-tier vias in monolithic 3d IC packaging system
  ECS Journal of Solid State Science and Technology 2021 DOI: 10.1149/2162-8777/ac31cd
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• Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization
  IEEE Transactions on Nanotechnology 2021 DOI: 10.1109/TNANO.2021.3058760
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