Vivek Sangwan

About

Vivek Sangwan received the B.Tech. degree in electronics and communication engineering from Dr. A.P.J. Abdul Kalam Technical University (formerly known as Gautam Buddha Technical University), Lucknow, India, in 2012, and the M.Tech. degree in electronics and communication engineering from Amity University, Noida, India, in 2014. He received a Ph.D. degree in electronic engineering at the Department of Electronic Engineering, Chang Gung University, Taiwan in 2019.
He is currently a Post Doctoral Researcher in Center for Reliability Sciences and Technologies, Chang Gung University, Taiwan.
His research interests include GaN-HEMT reliability, failure analysis, electromagnetic compatibility, electromagnetic interference, antenna and electromigration.

Employment

• Center for Reliability Sciences and Technologies
  2020 - Present
• Nanyang Technological University Research Assistant
  2013 - 2014

Education

• Chang Gung University Ph. D.
  2015 - 2019
• Amity University Masters in Technology
  2012 - 2014
• Dr. A.P.J. Abdul Kalam Technical University Bachelor in Technology
  2008 - 2012

Projects & Funding

Projects & funding information is unavailable.

Publications (14)

• Dual-Band Full-Duplex Compact Antenna for Vehicular Application
  2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON) 2023 1 citation DOI: 10.1109/mapcon58678.2023.10464183
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• Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System
  Applied Sciences 2022 14 citations DOI: 10.3390/app12020640
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• Effect of 150 MeV protons on carbon nanotubes for fabrication of a radiation detector
  Nanotechnology 2021 3 citations DOI: 10.1088/1361-6528/ac056d
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• GaN-Based Readout Circuit System for Reliable Prompt Gamma Imaging in Proton Therapy
  Applied Sciences 2021 1 citation DOI: 10.3390/app11125606
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• Optimization of a T-Shaped MIMO Antenna for Reduction of EMI
  Applied Sciences 2020 2 citations DOI: 10.3390/app10093117
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• Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits
  Applied Sciences 2020 9 citations DOI: 10.3390/app10030748
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• Moisture resistance evaluation on single electronic package moulding compound
  Journal of Materials Chemistry C 2020 6 citations DOI: 10.1039/C9TC04298A
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• Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits
  2019 2nd International Conference on Communication Engineering and Technology (ICCET) 2019 0 citations DOI: 10.1109/iccet.2019.8726894
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• ELECTROMAGNETIC HOTSPOTS IDENTIFICATION IN INTEGRATED CIRCUITS
  Progress In Electromagnetics Research Letters 2019 1 citation DOI: 10.2528/pierl19062601
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• Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier
  IEEE Transactions on Industrial Electronics 2019 17 citations DOI: 10.1109/tie.2019.2931233
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• Electromagnetic emissions from GaN power IC at varying distance and frequency
  2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 2018 0 citations DOI: 10.1109/ISEMC.2018.8393869
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• High-Frequency Electromagnetic Simulation and Optimization for GaN-HEMT Power Amplifier IC
  IEEE Transactions on Electromagnetic Compatibility 2018 22 citations DOI: 10.1109/TEMC.2018.2820202
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• Effect of ULSI interconnect layout on its Electromagnetic Emission
  2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings 2017 0 citations DOI: 10.1109/ICSICT.2016.7998965
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• Simulation of EMI at design level for integrated circuits
  2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016 2016 9 citations DOI: 10.1109/APEMC.2016.7522745
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