Ravi Mahajan

Employment

• Intel Corp Fellow
  1992 - Present

Education

• Lehigh University PhD
  1987 - 1992

Projects & Funding

Projects & funding information is unavailable.

Publications (5)

• The heterogeneous integration of electronic components
  Nature Reviews Electrical Engineering 2026 DOI: 10.1038/s44287-026-00270-1
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• Scaling EMIB—A Comprehensive Architecture Portfolio for Localized Interconnects
  IEEE Transactions on Electron Devices 2025 DOI: 10.1109/TED.2025.3574287
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• Advanced packaging of chiplets for future computing needs
  Nature Electronics 2024 DOI: 10.1038/s41928-024-01175-3
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• Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities
  Journal of Lightwave Technology 2022 DOI: 10.1109/JLT.2021.3104725
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• Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2019 DOI: 10.1109/TCPMT.2019.2942708
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