Anish Pal

Employment

• University of Illinois at Chicago Student

Education

Education history is unavailable.

Projects & Funding

Projects & funding information is unavailable.

Publications (18)

• Entropy Generation Minimized Design of Constant Volume Multi Tube Evaporators for Electronics Cooling via Machine Learning Assisted Hybrid Optimization Model
  2026 DOI: 10.2139/ssrn.6708106
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• TSV Topology-Driven Phase-Change Cooling in Interposer-Integrated Diverging Microchannels for 3D Electronic Packages
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2026 DOI: 10.1109/TCPMT.2026.3707060
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• TSV Topology-Driven Phase-Change Cooling in Interposer-Integrated Diverging Microchannels for 3D Electronic Packages
  2026 DOI: 10.2139/ssrn.6871359
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• Laser‐Microscribed Glass Enables Surface‐Microfluidics‐Facilitated, Affordable, Rapid Cancer Diagnosis
  Advanced Functional Materials 2026 DOI: 10.1002/adfm.202524446
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• Entropy generation minimization in multi-tube evaporators under constant volume conditions using R32 refrigerant via a hybrid genetic and gradient-based optimization approach
  Thermal Science and Engineering Progress 2025 DOI: 10.1016/j.tsep.2025.104107
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• Quasi‐Periodic Surface Functionalization by Ultra‐Short Pulsed Laser Processing: Unlocking Superior Heat Transfer in Vapor Chambers
  Advanced Functional Materials 2025 DOI: 10.1002/adfm.202508745
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• Empirical Analysis of Frictional Forces in Advancing and Receding Triple‐Phase Contact Lines: Effect of Surface Roughness
  Advanced Materials Interfaces 2025 DOI: 10.1002/admi.202500258
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• A Scalable Methodology for Reinstating the Superhydrophilicity of Ambient-Contaminant Compromised Surfaces
  ACS Applied Materials & Interfaces 2025 DOI: 10.1021/acsami.5c00724
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• Optimized designs for high-efficiency particle sorting in serpentine microfluidic channels
  Physics of Fluids 2025 DOI: 10.1063/5.0261598
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• Atmospheric Water Vapor Condensation on Ultra-short Pulsed Laser Surface-Processed Copper
  2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2024 DOI: 10.1109/itherm55375.2024.10709457
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