Manoj Kumar Pal

About

A Materials Research Scientist with a Doctorate Degree in Materials Science and Technology from the University of Miskolc, Hungary. In the past, I have worked in Academia with contributions to consultancy, Mechanical Engineering related laboratories setups and heading research-related activities of the Institutional campus of SRM University at Ghaziabad campus.
I worked in the research field of lead-free solder composite materials used in the electronic industries and participated as a research assistant in the project GINOP-2.3.2-15-2.16-00027, “Sustainable operation of the workshop of excellence for the research and development of crystalline and amorphous nanostructured materials” project implemented in the framework of the European Union Szechenyi 2020 program.
Currently working as, a Materials Research Scientist in the Group of Nuclear Material Science at the HUN-REN Wigner Research Centre for Physics Budapest, Hungary since May 2022. Responsible for Material characterization, Microstructural analysis, FIB-SEM (Focused-Ion Beam-Scanning Electron Microscope), Surface modification, and Defect analysis.

Employment

• Wigner Research Centre for Physics Researcher
  2022 - Present
• SRM Institute of Science and Technology - Delhi NCR Campus Assistant Professor
  2009 - 2016

Education

• Birla Institute of Technology master of engineering
  2006 - 2008

Projects & Funding

Projects & funding information is unavailable.

Publications (16)

• Numerical Investigation of In‐Mold Electromagnetic Stirring Effects on Flow Dynamics, Solidification Kinetics, and Inclusion Control
  Heat Transfer 2026 DOI: 10.1002/htj.70333
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• Low-energy Measurement of the 86Kr(α, n)89Sr Reaction Cross Section and Its Impact on Weak R-process Nucleosynthesis
  The Astrophysical Journal 2025 DOI: 10.3847/1538-4357/ade4c9
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• Measurement of β-particles to determine cross sections relevant to the weak r-process
  Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 2025 DOI: 10.1016/j.nima.2025.170272
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• Morphological and mechanical evolution of α-Al2O3 reinforced Mo Cu alloy obtained by planetary ball milling
  Journal of Manufacturing Processes 2023 DOI: 10.1016/j.jmapro.2023.08.034
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• Nucleation and location of Kirkendall voids at the Tin‐based solder/copper joint: a review
  Advanced Engineering Materials 2023 DOI: 10.1002/adem.202300671
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• Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition
  Journal of Materials Research and Technology 2023 DOI: 10.1016/j.jmrt.2023.05.091
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• Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys
  Powder Metallurgy and Metal Ceramics 2021 DOI: 10.1007/s11106-021-00262-w
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• Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate
  Intermetallics 2021 DOI: 10.1016/j.intermet.2020.106991
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• Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix
  Crystal Research and Technology 2020 DOI: 10.1002/crat.202000123
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• Characterization of the interface between ceramics reinforcement and lead-free solder matrix
  Surfaces and Interfaces 2020 DOI: 10.1016/j.surfin.2020.100576
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