Tamal Ghosh

Employment

• Indian Institute of Engineering Science and Technology, Shibpur

Education

Education history is unavailable.

Projects & Funding

Projects & funding information is unavailable.

Publications (26)

• Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration
  Lecture Notes in Networks and Systems 2024 DOI: 10.1007/978-981-97-2611-0_42
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• A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding
  Lecture Notes in Electrical Engineering 2023 DOI: 10.1007/978-981-99-0055-8_35
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• Heat Mitigation in 3D ICs by Improvised TTSV Structure
  3rd International Symposium on Devices, Circuits and Systems, ISDCS 2020 - Proceedings 2020 DOI: 10.1109/ISDCS49393.2020.9262977
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• Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal through Silicon Vias
  2020 IEEE 15th International Conference on Industrial and Information Systems, ICIIS 2020 - Proceedings 2020 DOI: 10.1109/ICIIS51140.2020.9342651
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• Diffusion enhanced drive sub 100 °C wafer level fine-pitch Cu-Cu thermocompression bonding for 3D IC integration
  Proceedings - Electronic Components and Technology Conference 2019 DOI: 10.1109/ECTC.2019.00-24
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• Surface Density Gradient Engineering Precedes Enhanced Diffusion; Drives CMOS In-Line Process Flow Compatible Cu-Cu Thermocompression Bonding at 75 °C
  IEEE Transactions on Device and Materials Reliability 2019 DOI: 10.1109/TDMR.2019.2952927
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• Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering
  Electronic Materials Letters 2018 DOI: 10.1007/s13391-018-0037-y
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• Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications
  Proceedings - Electronic Components and Technology Conference 2018 DOI: 10.1109/ECTC.2018.00237
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• Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu-Cu bonding at sub 200 °c for three-dimensional Integration applications
  Japanese Journal of Applied Physics 2018 DOI: 10.7567/JJAP.57.02BC04
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• Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °c Cu-Cu Wafer on Wafer Thermocompression Bonding
  IEEE Transactions on Electron Devices 2017 DOI: 10.1109/TED.2017.2653188
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