Shantanu Deshpande

Employment

• View Inc. Reliability Engineer
  2018 - Present
• Auburn University Research Assistant
  2012 - 2018

Education

• Auburn University Ph.D.
  2012 - 2018
• University of Pune Bachelors in Mechanical Engineering
  2007 - 2011

Projects & Funding

Projects & funding information is unavailable.

Publications (22)

• Study of the effect of solder-joint voiding using X-ray MicroCT data-based FE Models with experimental validation
  InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2019 DOI: 10.1109/ITHERM.2019.8757445
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• Copper, silver, and PCC wirebonds reliability in automotive underhood environments
  ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 2018 DOI: 10.1115/IPACK2018-8358
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• Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System
  Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 2018 DOI: 10.1109/ITHERM.2018.8419624
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• Effect of Thermal Cycling on Reliability of QFN Packages
  Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 2018 DOI: 10.1109/ITHERM.2018.8419496
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• Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment
  Proceedings - Electronic Components and Technology Conference 2018 DOI: 10.1109/ECTC.2018.00113
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• Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper-Aluminum Wirebond in PEMs
  IEEE Transactions on Components, Packaging and Manufacturing Technology 2017 DOI: 10.1109/TCPMT.2017.2672498
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• Effect of EMCs on the high current reliability of Cu wirebonds operating in harsh environments
  Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 2017 DOI: 10.1109/ITHERM.2017.7992634
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• Measurement of ion-mobility in copper-aluminum wirebond electronics under operation at high voltage and high temperature
  ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems 2017 DOI: 10.1115/IPACK2017-74325
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• Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments
  Proceedings - Electronic Components and Technology Conference 2017 DOI: 10.1109/ECTC.2017.300
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• Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments
  Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 2017 DOI: 10.1109/ITHERM.2017.7992630
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