NIRUPAM PAUL

Employment

Employment history is unavailable.

Education

• Indian Institute of Technology Hyderabad PhD
  2015 - 2021

Projects & Funding

Projects & funding information is unavailable.

Publications (12)

• Silicon Membranes for Microbolometers: Simulation and Fabrication Using Frontend Bulk Micromachining
  2024 IEEE International Conference of Electron Devices Society Kolkata Chapter (EDKCON) 2024 DOI: 10.1109/edkcon62339.2024.10870751
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• Fabrication and characterization of suspended La0.7Sr0.3MnO3 nanofibers for high-sensitive and fast-responsive infrared bolometer
  Journal of Micromechanics and Microengineering 2023 DOI: 10.1088/1361-6439/ad0a3c
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• Fabrication of Area Effective Silicon Membrane By Frontend Bulk Micromachining for High Pixel Density Thermal Imager Array
  ECS Meeting Abstracts 2020 DOI: 10.1149/MA2020-01312315mtgabs
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• Facile Synthesis of Electrospun Nickel (II) Oxide Nanofibers and Its Application for Hydrogen Peroxide Sensing
  ChemistrySelect 2018 DOI: 10.1002/slct.201802526
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• Dependency of fT and fMAX on Various Device Parameters of AIGaN/GaN HEMT
  2018 IEEE Electron Devices Kolkata Conference (EDKCON) 2018 DOI: 10.1109/edkcon.2018.8770466
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• Thermal and Optoelectrical Analysis of La0.7Sr0.3MnO3 Thin Film Thermistor in 8–12 μm Range for Uncooled Microbolometer Application
  2018 IEEE Electron Devices Kolkata Conference (EDKCON) 2018 DOI: 10.1109/edkcon.2018.8770457
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• Enhanced infrared sensing properties of vanadium pentoxide nanofibers for bolometer application
  Materials Science in Semiconductor Processing 2018 DOI: 10.1016/j.mssp.2018.03.018
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• Vanadium Pentoxide Nanofibers as IR Sensors for Bolometer Applications
  ECS Transactions 2018 DOI: 10.1149/08513.1573ecst
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• Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application
  2018 IEEE International Interconnect Technology Conference (IITC) 2018 DOI: 10.1109/iitc.2018.8430450
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• Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding
  2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018 DOI: 10.1109/ectc.2018.00260
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