AV

Ayush Verma

Also known as: Ayush

Intel Corporation, Nanyang Technological University, Cornell University, Netaji Subhas University of Technology, KU Leuven

ORCID iD 0000-0003-4981-0330
Follow

About

M.S. Materials Science and Engineering, Cornell University (2026). My thesis work is on mesoporous superconducting thin films, essentially figuring out how to synthesize NbN superconductors using block copolymer self-assembly that can integrate into silicon-based quantum devices. Last summer I was at Intel, working on CDSEM metrology for their 18A and 14A logic nodes, developing recipes and fixing surface charge problems that directly affect how reliably you can measure features on next-generation chips.

Before Cornell, I did my undergrad in Mechanical Engineering at NSUT Delhi. My research there was on friction stir welding of aluminum alloys, and I also spent time at NTU Singapore designing auxetic scaffolds for bone engineering applications.

I'm broadly fascinated by where quantum materials meet semiconductor fabrication; the idea that what we grow and synthesize at the atomic scale today ends up inside the chips driving AI tomorrow is something I find genuinely exciting to work on.

Outside the lab, I read a lot, listen to rap, and do theatre.

Employment

  • Nanyang Technological University Research Assistant Intern
    2023 - 2023
  • KU Leuven Research Assistant Intern
    2022 - 2022
  • Escorts Limited R&D Intern
    2022 - 2022
  • Netaji Subhas University of Technology Research Assistant Intern
    2021 - 2021
  • Intel Corporation Metrology Engineeering Intern

Education

  • Cornell University MS
    2024 - 2026
  • Netaji Subhas University of Technology Bachelor of Technology (Btech)
    2020 - Present

Projects & Funding

Projects & funding information is unavailable.

Publications (5)