Dileep Kumar Mishra

Employment

• Institute of Microelectronics Scientist I
  2022 - Present
• Indian Institute of Technology Bombay PhD Research Scholar
  2017 - 2022

Education

Education history is unavailable.

Projects & Funding

Projects & funding information is unavailable.

Publications (34)

• Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding
  2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024 DOI: 10.1109/ectc51529.2024.00019
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• Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications
  2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024 DOI: 10.1109/ectc51529.2024.00345
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• Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
  2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024 DOI: 10.1109/ectc51529.2024.00102
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• Improved waveguide surface roughness by foundry-processing techniques for enhanced light delivery to integrated ion trap for quantum computing platforms
  Optical Interconnects XXIV 2024 DOI: 10.1117/12.3001329
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• Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications
  2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023 DOI: 10.1109/eptc59621.2023.10457606
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• Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications
  2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023 DOI: 10.1109/eptc59621.2023.10457892
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• Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors
  2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023 DOI: 10.1109/eptc59621.2023.10457687
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• Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding
  2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023 DOI: 10.1109/eptc59621.2023.10457883
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• Etching of micro-channels in fused quartz for novel device applications
  Materials Today: Proceedings 2023 DOI: 10.1016/j.matpr.2023.07.253
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• Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
  2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023 DOI: 10.1109/ectc51909.2023.00100
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• Automated Analysis of AFM Data of High-Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W) Hybrid Bonding
  2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022 DOI: 10.1109/eptc56328.2022.10013174
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• Evaluation of Polymer Materials for Hybrid Bonding Application
  2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022 DOI: 10.1109/eptc56328.2022.10013162
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• Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding Applications
  2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022 DOI: 10.1109/eptc56328.2022.10013147
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• Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining
  Dileep Kumar Mishra, Pradeep Dixit
  Materials and Manufacturing Processes 2022 DOI: 10.1080/10426914.2022.2146718
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• Electrochemical Discharge Machining
  Advanced Machining Science 2022 DOI: 10.1201/9780429160011-13
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• Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
  Applied Surface Science 2022 DOI: 10.1016/j.apsusc.2022.152494
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• Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process
  Tarlochan Singh, Dileep Kumar Mishra, Pradeep Dixit
  Journal of Applied Electrochemistry 2022 DOI: 10.1007/s10800-021-01662-x
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• Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications
  Dileep Kumar Mishra, Tarlochan Singh, Pradeep Dixit
  Materials and Manufacturing Processes 2021 DOI: 10.1080/10426914.2021.2001520
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• Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling
  Measurement 2021 DOI: 10.1016/j.measurement.2020.108463
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• Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process
  Journal of Manufacturing Processes 2021 DOI: 10.1016/j.jmapro.2021.10.009
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