MA
M Z Abdullah
Universiti Sains Malaysia - Kampus Kejuruteraan Seri Ampangan
Research areas: Engineering · Electrical and Electronic Engineering · Electronic Packaging and Soldering Technologies · Heat Transfer and Optimization · Welding Techniques and Residual Stresses
0000-0002-5353-6162
Employment
-
Universiti Sains Malaysia - Kampus Kejuruteraan Seri Ampangan Professor1997 - Present
Education
Education history is unavailable.
Projects & Funding
Projects & funding information is unavailable.
Publications (297)
- A New Method for Assessing the Performance of Photovoltaic Module Enhancing Techniques Based on the Lifespan and Power Effectiveness Factor Save
- Optimization of the Assessment Method for Photovoltaic Module Enhancers: A Cost-Efficient Economic Approach Developed through Modified Area and Cost Factor Save
- A Detailed Analysis of the Modified Economic Method for Assessing the Performance of Photovoltaic Module Enhancing Techniques Save
- An Experimental Investigation into Mechanical and Thermal Properties of Hybrid Woven Rattan/Glass-Fiber-Reinforced Epoxy Composites Save
- Thermophysical Properties of Vegetable Oil-Based Hybrid Nanofluids Containing Al2O3-TiO2 Nanoparticles as Insulation Oil for Power Transformers Save
- Influence of Nanoparticles on Thermophysical Properties of Hybrid Nanofluids of Different Volume Fractions Save
- Overview of the Important Factors Influencing the Performance of Eco-Friendly Brake Pads Save
- Double-Layer Micro Porous Media Burner from Lean to Rich Fuel Mixture: Analysis of Entropy Generation and Exergy Efficiency Save
- Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review Save
- Enhancement in Cathodic Redox Reactions of Single-Chambered Microbial Fuel Cells with Castor Oil-Emitted Powder as Cathode Material Save
- Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process Save
- Entropy Generation and Exergy Analysis of Premixed Fuel-Air Combustion in Micro Porous Media Burner Save
- Cad-based 3d grain burnback analysis for solid rocket motors Save
- Design Optimization of Solid Rocket Propulsion: A Survey of Recent Advancements Save
- Effect of adhesive force on underfill process based on lattice Boltzmann method Save
- Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation Save
- Effect of pin inclination angle on flow and heat transfer characteristics for a row of pins in a flow channel Save
- Experimental analysis on combustion eharaeteristies of single layer porous media for various burner sizes Save
- Filling efficiency of flip-chip underfill encapsulation process Save
- Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects Save