SANJAY TIKALE

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Publications (8)

• The effect of multi-walled carbon nanotubes reinforcement and multiple reflow cycles on shear strength of SAC305 lead-free solder alloy
  Materials Performance and Characterization 2019 DOI: 10.1520/MPC20180044
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• Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates
  Transactions of the Indian Institute of Metals 2019 DOI: 10.1007/s12666-019-01568-5
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• Assessment of the Performance of Sn–3.5Ag/Cu Solder Joint Under Multiple Reflows, Thermal Cycling and Corrosive Environment
  Transactions of the Indian Institute of Metals 2018 DOI: 10.1007/s12666-018-1430-9
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• Effect of Multiple Reflow Cycles and Al<inf>2</inf>O<inf>3</inf> Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy
  Journal of Materials Engineering and Performance 2018 DOI: 10.1007/s11665-018-3390-y
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• Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al<inf>2</inf>O<inf>3</inf> Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy
  Transactions of the Indian Institute of Metals 2018 DOI: 10.1007/s12666-018-1413-x
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• Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles
  Transactions of the Indian Institute of Metals 2018 DOI: 10.1007/s12666-018-1431-8
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• Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
  Materials Performance and Characterization 2017 DOI: 10.1520/MPC20160058
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• Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
  Materials Science Forum 2015 DOI: 10.4028/www.scientific.net/MSF.830-831.215
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