Sandeep Kumar

Employment

• Indian Institute of Technology Bhubaneswar

Education

Education history is unavailable.

Projects & Funding

Projects & funding information is unavailable.

Publications (11)

• Design and performance analysis of thin-film solar cell
  2026 DOI: 10.1201/9781003635123-4
  +Save
• A Novel De-Mirroring-Based Analytical Model for Capacitance Extraction of Nanosheet FET Using Dielectric Permittivity Suppression
  IEEE Transactions on Dielectrics and Electrical Insulation 2026 DOI: 10.1109/TDEI.2025.3619803
  +Save
• The Role of Dielectric Wall in Forksheet FET: Exploring Electrical-Thermal Intercoupling
  IEEE Transactions on Dielectrics and Electrical Insulation 2026 DOI: 10.1109/TDEI.2025.3610405
  +Save
• On the Reliability of Complementary Field Effect Transistor: Unveiling the Role of Grain Granularities and Random Fluctuations
  IEEE Transactions on Device and Materials Reliability 2026 DOI: 10.1109/TDMR.2026.3665263
  +Save
• Demonstrating the Electro-Thermal Dynamics in Complementary FETs: Quantifying the Role of Self-Heating and Grain Effect Intercoupling
  IEEE Transactions on Electron Devices 2026 DOI: 10.1109/TED.2026.3664068
  +Save
• Electro-thermal Reliability Assessment of an Asymmetric Spacer Complementary FET: Device to Circuit Co-optimization
  IEEE Transactions on Device and Materials Reliability 2026 DOI: 10.1109/TDMR.2026.3716119
  +Save
• Reliability Assisted Electro-Physical Modelling of Radiation-Induced Resistance Fluctuation in Nanosheet FET
  IEEE Transactions on Device and Materials Reliability 2026 DOI: 10.1109/TDMR.2026.3713056
  +Save
• Assessing the impact of process and design variations on reliability of complementary FET
  Solid-State Electronics 2025 DOI: 10.1016/j.sse.2025.109226
  +Save
• Statistical analysis of random dopant fluctuation in Complementary FET
  Solid-State Electronics 2025 DOI: 10.1016/j.sse.2025.109254
  +Save
• Demonstrating Novel Interbridge Complementary FET: Capacitance Extraction using Dielectric Permittivity Suppression and Conformal Mapping
  IEEE Transactions on Dielectrics and Electrical Insulation 2025 DOI: 10.1109/TDEI.2025.3645707
  +Save